Nvidia CEO Jensen Huang Says A New Chip Will 'Surprise the World' at GTC 2026
Nvidia chief executive Jensen Huang stated the company will reveal multiple new chips at its annual GPU Technology Conference scheduled for March 16 to 19 in San Jose, California.
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| Credit: Future |
Huang made the announcement during an exclusive interview on February 14 in Santa Clara after a dinner meeting with engineers from Nvidia and partner SK Hynix at a local Korean chicken restaurant.
In an interview with the Korean Economic Daily, Huang stated that Nvidia will announce "a chip that will surprise the world" at GTC 2026.
The GTC is Nvidia's largest yearly gathering focused on graphics processing units and artificial intelligence advancements.
Huang specified that the forthcoming chips relate to the next-generation AI processor named Vera Rubin, which incorporates high-bandwidth memory technology developed in collaboration with SK Hynix.
The partnership addresses computational bottlenecks in AI workloads through the integration of HBM4, the sixth-generation high-bandwidth memory set to enhance data transmission speeds and overall performance.
Huang described the joint effort between Nvidia and SK Hynix as forming "one huge team" dedicated to overcoming technical limits in semiconductor design.
"We have prepared a few new chips that the world has never seen before," Huang said in the interview.
He acknowledged the difficulties involved, stating:
"Everything is at its limit, so nothing is easy."
Huang expressed assurance in the outcome due to the combined expertise, adding that the team had worked intensively on the Vera Rubin project and deserved recognition for their contributions.
The disclosure aligns with Nvidia's broader activities in the AI sector, including a $20 billion acquisition of core technology and personnel from inference language processing unit designer Grok in December 2025.
Nvidia also committed $860 million to nuclear fusion startup Commonwealth Fusion Systems as part of its investments across the AI infrastructure stack, encompassing energy, semiconductors, data centers, cloud services, and applications.
Huang addressed market conditions by asserting that artificial intelligence development stands at the initial phase of a multitrillion-dollar infrastructure initiative.
He met with SK Hynix engineers to celebrate progress on the HBM4 integration, where participants shared soju and chicken in a casual setting to mark their collaborative achievements.
